Wafer Used Dry Etching Equipment Market size was valued at US$ 9

Wafer Used Dry Etching Equipment Market size was valued at US$ 9.67 billion in 2024 and is projected to reach US$ 18.42 billion by 2032, at a CAGR of 9.7% during the forecast period 2025-2032

The global Wafer Used Dry Etching Equipment Market size was valued at US$ 9.67 billion in 2024 and is projected to reach US$ 18.42 billion by 2032, at a CAGR of 9.7% during the forecast period 2025-2032.

Dry etching equipment is a critical semiconductor manufacturing tool that uses plasma to selectively remove material from wafers with high precision. The process involves three main types: silicon etch (for silicon substrates), dielectric etch (for insulating layers), and conductor etch (for metal interconnects). Key components include RF power sources, vacuum chambers, and advanced gas delivery systems that enable nanometer-scale patterning.

Market growth is driven by surging demand for advanced logic and memory chips, particularly for 5G, AI, and IoT applications. The transition to smaller nodes (below 7nm) and adoption of new architectures like GAA (Gate-All-Around) requires more sophisticated etching solutions. While the industry faces challenges from geopolitical trade restrictions and supply chain complexities, recent expansions by leading foundries (TSMC, Samsung, and Intel) in the U.S., Europe, and Asia are creating new equipment demand. Lam Research, Applied Materials, and Tokyo Electron collectively hold over 75% of the market share, with ongoing R&D focusing on high-aspect-ratio etching for 3D NAND and DRAM application.

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MARKET DRIVERS

The global semiconductor industry is experiencing unprecedented growth, with projections indicating continued expansion in the coming years. This growth stems from ubiquitous chip demand across consumer electronics, automotive applications, and IoT devices. Wafer dry etching equipment enables precise pattern transfer during semiconductor manufacturing, making it indispensable for advanced node production. With semiconductor foundries ramping up capacity to meet demand, manufacturers are investing heavily in dry etching solutions to enhance production efficiency and yield.

The transition to smaller process nodes below 7nm has significantly increased the complexity of etching requirements. Advanced logic and memory devices now demand atomic-level precision, driving adoption of cutting-edge dry etchers with enhanced control capabilities. Leading manufacturers have responded with innovative systems that provide superior etch uniformity and profile control, enabling continued semiconductor miniaturization.

Recent Development

🔹 China’s domestic etch‑equipment sees major growth

• As of 2024, internally produced wafer fabrication tools—including dry etchers—accounted for 11.3% of China’s machinery purchases, up from just 5.1% in 2020
• Chinese firms Naura and AMEC experienced explosive growth: Naura’s revenue quintupling to ¥29.8 bn and AMEC’s rising fourfold to ¥9.1 bn in 2024
• However, China remains behind in advanced-node tool development (< 7 nm), especially in lithography, though dry etch capabilities are a relative bright spot

 SiCarrier surfaces as a serious player

• SiCarrier, closely tied to Huawei, aims to become China’s premier chip-equipment maker. It’s seeking US $2.8 bn in funding and has showcased more than 30 tools at Semicon China 2025
• Its product suite includes etching systems aimed at 5 nm production; the firm claims its multi-layer patterning tools mirror 5 nm capabilities without EUV usage

List of Major Dry Etching Equipment Manufacturers

• Lam Research Corporation (U.S.)
• Tokyo Electron Limited (Japan)
• Applied Materials, Inc. (U.S.)
• Hitachi High-Tech Corporation (Japan)
• SEMES Co., Ltd. (South Korea)
• AMEC (China)
• NAURA Technology Group Co., Ltd. (China)
• SPTS Technologies (KLA Corporation) (U.K.)
• Oxford Instruments (U.K.)
• ULVAC, Inc. (Japan)
• Plasma-Therm LLC (U.S.)

Segment Analysis:

By Type

Silicon Etch Segment Dominates Due to High Demand in Semiconductor Manufacturing

The global wafer used dry etching equipment market is segmented based on type into:

• Silicon Etch
• Dielectric Etch
• Conductor Etch
• Compound Semiconductor Etch
• Others

By Application

Foundry Application Leads Owing to Increasing Semiconductor Fabrication Activities

The market is segmented by application into:

• IDM (Integrated Device Manufacturers)
• Foundry
• Memory
• Logic & MPU
• Others

By Technology

Reactive Ion Etching (RIE) Maintains Strong Position Due to Superior Etching Control

Key technology segments include:

• Reactive Ion Etching (RIE)
• Deep Reactive Ion Etching (DRIE)
• Inductively Coupled Plasma (ICP) Etching
• Cryogenic Etching
• Others

By Wafer Size

300mm Segment Shows Strong Adoption to Support Advanced Node Manufacturing

The market is segmented by wafer size into:

• 200mm
• 300mm
• 450mm
• Others

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